2G/3G Firmware Engineer required for Infineon Technologies

2G/3G Firmware Engineer

Mandatory Skills:

• Skilled in optimization of DSP algorithms for DSP or ARM processors
• Good understanding of Physical Layer of Wireless Communication
• Systems OR Audio/Speech/Video Signal Processing

Desirable Skills:

• Familiarity with RTOS concepts
• Familiarity with 2G/3G Physical Layer

Experience:

• 3+ years of experience

Qualification:

• BTECH/ME/MTECH in ECE/EE/CS

Contact: getjobsinindia2007@gmail.com